Indium Corporation Expert Honored by IEEE EPS · EMSNow
Posted by Jennifer Read | Jun 7, 2023 | Associations, Materials for electronic assembly, News, Solder paste
Indium Corporation Strategic Advisor Dr. Dongkai Shangguan was honored by the IEEE Electronics Packaging Society (EPS) with its 2023 Electronics Manufacturing Technology Award at the 73rd Electronics Components and Technology Conference (ECTC) in Orlando, FL.
The award serves to recognize major contributions to electronics manufacturing technology in fields encompassed by the IEEE EPS. Dr. Shangguan was honored with this year's award in recognition of his leadership in miniaturization, reliability, and sustainability of high density electronics in global manufacturing across industry segments.
"It is a tremendous honor to be recognized by IEEE EPS with the Electronics Manufacturing Technology Award and join a distinguished list of prior recipients," said Dr. Shangguan.
Dr. Shangguan is a strategic advisor to Indium Corporation. In this role, he works on specific trends related to the advanced semiconductor packaging and SMT industries, and applies his significant industry experience to supporting customers. Dr. Shangguan is an IEEE Fellow and IMAPS Fellow, and has served on the boards of directors for several professional organizations and industry associations, including IPC, IEEE EPS, and iNEMI. He also served as a Distinguished Lecturer for IEEE EPS. He has been honored with some of the industry's most prestigious awards, including IPC's President's Award, the Society of Manufacturing Engineers’ (SME) Total Excellence in Electronics Manufacturing Award, the Outstanding Sustained Technical Contribution Award from IEEE EPS, and the William D. Ashman Achievement Award from IMAPS, among others.
Dr. Shangguan received a bachelor's degree in mechanical engineering from Tsinghua University, China, an MBA from San Jose State University, Calif., and a Ph.D. in materials from the University of Oxford, U.K. He has held postdoctoral positions at the University of Cambridge, U.K., and the University of Alabama, and has served as a guest professor at several universities. Dr. Shangguan has published two books and more than 200 scientific papers and technical articles, and has given numerous presentations to share knowledge and expertise with the industry. He is the inventor/co-inventor of 30 U.S. patents and several foreign patents.
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